发明名称 |
Chuck for substrate processing and method for depositing a film in a radio frequency biased plasma chemical depositing system |
摘要 |
A chuck for processing a substrate includes a chuck body having a dielectric layer, the dielectric layer including a substrate receiving surface, the substrate receiving surface being at least as large as a substrate to be processed on the chuck. The chuck further includes an electrode buried in the chuck body, the electrode being larger than the substrate receiving surface such that edges of a radio frequency field generated by the electrode are all disposed beyond the substrate receiving surface. A method for depositing a film in a radio frequency biased plasma chemical deposition system is also disclosed.
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申请公布号 |
US5841623(A) |
申请公布日期 |
1998.11.24 |
申请号 |
US19950577535 |
申请日期 |
1995.12.22 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
DENISON, DEAN R.;PIRKLE, DAVID R.;HARRUS, ALAIN |
分类号 |
H01L21/683;H02N13/00;(IPC1-7):H02N13/00 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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