发明名称 |
Optical component package |
摘要 |
Disclosed is an optical package which is economical to manufacture. An optical component, such as a PIN photodiode, is bonded to a substrate such as silicon with no metallization on its side surfaces. The resulting assembly is solder bonded to the bottom surface of the package so that a side surface of the substrate is adjacent to the bottom surface with essentially no solder therebetween.
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申请公布号 |
US5841178(A) |
申请公布日期 |
1998.11.24 |
申请号 |
US19960720888 |
申请日期 |
1996.10.04 |
申请人 |
LUCENT TECHNOLOGIES INC. |
发明人 |
BUTRIE, TIMOTHY;DAUTARTAS, MINDAUGAS FERNAND;SCRAK, SHAUN P. |
分类号 |
H01L31/0203;(IPC1-7):H01L31/020 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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