摘要 |
Integrated circuit chips are screened for susceptibility to latch-up by first applying power and ground to the chips to be tested while limiting current flow to a non-destructive compliance value. Next, the chips are irradiated with a pulse of radiation having an energy dose calibrated to trigger latch-up in latch-up sensitive chips. Upon termination of the radiation, the current is detected. Chips having current persisting at the compliance value are indicated as failing. The current in passing chips returns approximately to the original standby current value. In the preferred embodiment, the radiation is visible light and the radiation energy dose is selected to cause a percentage of chips to latch-up approximating the percentage of failures expected at burn-in.
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