| 摘要 |
PROBLEM TO BE SOLVED: To provide an easily openable pouch by a laser processed hole, wherein the laser processing time for the processed hole is short, and in addition, the openability is favorable. SOLUTION: The easily openable pouch comprises a single layer film or a multi-layer film, and of which the total thickness is 160 μm or less, and wherein laser processed holes 1 are serially provided at an unsealing location, and for such an easily openable pouch, the diameter of the laser processed hole 1 is made 10-200 μm, and the processing pitch is made 100-400 μm, and the processed holes are provided in such a manner that adjacent processed holes may not come into contact with. Also, the value of the rate of the diameter of the laser processed hole based on the processing pitch, is made 0.30-0.50. |
