发明名称 Semiconductor carrier strip trimming apparatus
摘要 A pallet for supporting strip material on which encapsulated circuit devices of the ball-grid array type are supported is delivered to a first cutter assembly. Rotary hardened steel cutter discs having radially extended cutting teeth separate the circuit devices as the cutter assembly is traversed to move the cutter blades in paths extended transversely of the strip material between adjacent circuit devices. Thereafter, the pallet is moved to a second cutter station at which a second cutter assembly trims strip material along paths extending transversely of the first paths. Pallet positioning means for precise positioning of pallets carrying the strip material include elevators having resilient supports which allow for limited lateral motion of the pallets as they are moved into positions of alignment with the cutter assemblies. The elevators further comprise negative pressure devices operable following pallet alignment for applying negative pressure to the circuit devices for holding the circuit devices in positions of alignment with the cutter blades during the cutting operations.
申请公布号 US5839337(A) 申请公布日期 1998.11.24
申请号 US19960671777 申请日期 1996.06.20
申请人 NEU, H. KARL 发明人 NEU, H. KARL
分类号 B23D45/10;B23D47/04;B26D7/01;B26D11/00;(IPC1-7):B65B61/08 主分类号 B23D45/10
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