BONDING APPARATUS, BONDING, AND MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a bonding apparatus and method which can eliminate the need for an operator to set bonding conditions. SOLUTION: The bonding apparatus automatically calculates bonding conditions including a central position of a semiconductor chip 1 and a central position of a die pad 3a on the basis of image data detected by a camera 12. Accordingly, it is unnecessary for an operator to set the bonding conditions in the bonding apparatus. Further, since position control of a housing 7 is carried out based on the bonding conditions calculated by the apparatus, the semiconductor chip 1 can be accurately mounted on a lead frame 3 at a suitable position.