| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered printed wiring board, possessed of a part mounting pad which is located on a blind through-hole and high in electric connection reliability after a part is mounted on it. SOLUTION: Outer boards 8 each provided with through-holes (via holes), metal foils 11 each with a roughened surface, release films 12, and plates 13 as outermost layers are provided to each surface of an inner circuit board through the intermediary of a prepreg for the formation of a press target body, and the metal foil 11 and the release film 12 are made to encroach into the through-holes (via holes) provided to the outer boards 8 in an initial laminating press stage. By this setup, in this press laminating process, prepreg molten resin injected into the through-holes (via holes) is set back from the outer surface, and the roughened surface of the metal foil 11 is transferred onto the surface of the prepreg molten resin. |
