| 摘要 |
PROBLEM TO BE SOLVED: To improve the quality of a wafer by solving the problem of particles adhering to the wafer due to insufficient quantity of air. SOLUTION: In a semiconductor manufacturing device, cassettes 3 containing wafers 2 are horizontally arranged in an enclosure 1, to which air is supplied from a clean unit 8 provided above the cassettes 3, from which air is evacuated by means of an exhaust fan 9 provided below the cassettes 3 and in which a wafer-transferring machine 5 which carries the wafers 2 is provided. The clean unit 8 is obliquely installed toward the cassettes 3, and at the same time, a mobile control board 10 which controls the flowing direction of the air is provided immediately below the unit 8 at a different angle, so that the air flow created by the plate 10 is made to flow through a space between each wafer 2 in the cassettes 3. |
