| 摘要 |
PROBLEM TO BE SOLVED: To provide a continuous process whereby an epoxy resin molding material contg. a silica filler in an amt. as high as 70-95 wt.% can be stably produced as a semiconductor-sealing material. SOLUTION: In producing an epoxy resin molding material contg. an epoxy resin, a curative, and 70-95 wt.% silica filler, the compounding ingredients in powdery forms are supplied to one end of the clearance between a pair of mixing rolls, the front and back rolls, and the resulting mixture is discharged from the other end. In this process, the angular velocity of rotation of the front roll 1, around which in a sheet form wound around the front roll is repeatedly sent into the clearance while being moved successively with scrapers 3 installed on the front roll toward the end, from which the mixture is discharged; and the mixture B in a sheet form is cut and separated from the roll surface with a sheet scraper 4 at the discharge end and thus is taken out. |
