发明名称 SEMIAROMATIC POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a semiarom. polyamide resin compsn. that has a good moldability and is excellent in creep characteristics at a high temp. and humidity, by compounding a copolyamide formed from a dicarboxylic acid component contg. terephthalic acid in a specified proportion and a diamine component comprising a linear and a branched alkylenediamine with an ethylene-α-olefin copolymer modified with an unsatd. carboxylic acid. SOLUTION: This compsn. comprises 99-60 wt.% copolyamide and 1-40 wt.% graft modified ethylene-α-olefin copolymer. The copolyamide is formed from a dicarboxylic acid component comprising 45 mol.% or higher terephthalic acid and up to 55 wt.% arom. and aliph. dicarboxylic acids and a diamine component comprising 55-99 mol.% 4-18C linear alkylenediamine and 1-45 mol.% 4-18C branched alkylenedieamine. The graft modified ethylene-α-olefin copolymer is prepd. by grafting 0.01-5 wt.% unsatd. carboxylic acid onto an ethylene-α- olefin copolymer having a max. peak temp. in the endothermic curve by DSC of 90-127 deg.C, a crystallinity of 20-60%, and a density of 0.89-0.95 g/cm<3> .
申请公布号 JPH10310697(A) 申请公布日期 1998.11.24
申请号 JP19980052273 申请日期 1998.03.04
申请人 MITSUI CHEM INC 发明人 OGO YOSHIMASA;AMIMOTO YOSHIKATSU
分类号 C08L77/06;C08K3/34;(IPC1-7):C08L77/06 主分类号 C08L77/06
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