| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board which is enhanced in spot facing accuracy by reducing the occurrence of warpage in the printed wiring board to an irreducible minimum. SOLUTION: A printed wiring board is manufactured through such a method that counter-bored holes 4 are provided to a multilayered laminate board from above its surface to expose an inner circuit pattern, which is made to serve as a part mounting site. In this case, a third dummy pattern 3 is provided between on uppermost pattern layer on a side where the counter-bored holes 4 are formed and a second pattern layer, whereby a multilayered laminated board provided with a layer structure which is set vertically symmetrical can be obtained, and the multilayered laminated board is subjected to spot facing.</p> |
