发明名称 LAMINATED CERAMIC ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To provide highly reliable laminated ceramic electronic parts in which the occurrence of delaminations or crackings can be suppressed during the course of a sintering process, even when the number of laminated internal electrodes is increased and the thickness of each ceramic layer is reduced and, in addition, which has superior thermal shock resistance. SOLUTION: Laminated ceramic electronic parts are constituted, so that the thickness of each ceramic layer 1a becomes <=10μm, the number of laminated internal electrodes 2 becomes >=200, the ratio of the thickness of each internal electrode 2 to that of the ceramic layer 1a (the ratio of thickness of each electrode 2 to the thickness of each ceramic layer 1a) becomes 0.10-0.40. The ratio of the total volume of the electrodes 2 to that of a ceramic element 3 (the volume of the electrodes 2 to the volume of the element 3) also become 0.10-0.30.
申请公布号 JPH10312933(A) 申请公布日期 1998.11.24
申请号 JP19970135823 申请日期 1997.05.09
申请人 MURATA MFG CO LTD 发明人 UENO YASUSHI;TAKAGI GIICHI;KAWABATA KAZUAKI;OMORI NAGATO
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/12
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