ADHESIVE FILM FOR SEMICONDUCTOR WAFER DICING, AND DICING OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To obtain the subject film capable of preventing the chip in dicing from causing dispersion, etc., by adjusting the subject film to have an adhesive layer containing a base polymer of a specific constitution and a crosslinking agent, and to have a specific sticking characteristic for the temperature change. SOLUTION: The objective adhesive film is the one having a sticker layer containing 100 pts.wt. base polymer obtained by copolymerizing (A) 40-98 wt.% at least one kind of monomer having a structure of the formula [R1 is H or CH3 ; X is COOR2 (R2 is a 10-50C aliphatic group), etc.], (B) 1-30 wt.% monomer having a functional group capable of reacting with a cross-linking agent, and (C) 1-59 wt.% monomer copolymerizable with the components A and B, and 0.1-5 pts.wt. crosslinking agent. The sticking power to the SUS 304-BA board is 150-2000 g/25 mm at A deg.C-40 deg.C and 100 g/25 mm at B deg.C-C deg.C [0