发明名称 |
Polishing apparatus |
摘要 |
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, a top ring, for holding a workpiece to be polished and pressing the workpiece against the polishing surface, which is movable between a polishing position inside of the turntable and a standby position outside of the turntable, and a first device for keeping at least a lower surface of the top ring wet while the top ring is in the standby position. The polishing apparatus further includes a dressing tool for dressing the polishing surface on the turntable, and a second device for keeping at least a lower surface of the dressing tool wet while the dressing tool is in a standby position.
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申请公布号 |
US5839947(A) |
申请公布日期 |
1998.11.24 |
申请号 |
US19970795511 |
申请日期 |
1997.02.05 |
申请人 |
EBARA CORPORATION |
发明人 |
KIMURA, NORIO;SAKURAI, KUNIHIKO;TOGAWA, TETSUJI;KATSUOKA, SEIJI;NISHI, TOYOMI |
分类号 |
B24B37/04;B24B53/007;B24B53/017;(IPC1-7):B24B5/00;B24B29/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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