| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve reliability of chucking of a substrate onto an electrostatic chuck, by a method wherein, after each chamber cleaning process, the substrate support surface of the chuck is subjected to precoating using a dielectric material. SOLUTION: Each chamber cleaning step is executed and thereafter, an in-situ chamber precoating step is executed and a dielectric layer 76 is deposited on the substrate support surface of an electrostatic chuck 32. The layer 76 is completely removed by the succeeding chamber cleaning process and is again deposited on the substrate support surface after each chamber cleaning step is executed. The thickness of the layer 76 is a thickness of about 1,000 to about 5,000Åand it is preferable that the layer 76 has a thickness of a low limit value which is decided by a chucking voltage to be applied. As a result the problem to confront with the chuck 32 due to the deterioration of the layer 76 is eliminated and the reliability of chucking of a substrate onto the chuck can be enhanced.</p> |
