| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a useless force from acting on a precision substrate also when a cover body is to be fitted and securely prevent play of the housed precision substrate in transporting it. SOLUTION: A plurality of precision substrates P for semiconductor wafers or the like are housed in a cassette 10 in the state the peripheral edges thereof are fitted loose in housing grooves and the cassette 10 is housed in a container body 20 at a slant. And the precision substrates P are shifted to one side and a cover body 30 is fitted from the extending direction of the precision substrates P in the cassette 10 onto the opening 23 of the container body 20. The pressing grooves 39a of the pressing member 39 of the cover body 30 are fitted loose on the upper edges of the precision substrates P to press them and prevent breakage of the substrates P when putting the cover body 30 or transporting the substrates covered with the cover body 30.</p> |
