| 摘要 |
<p>PROBLEM TO BE SOLVED: To make feasible of lowering the electric resistance also realizing the electric conduction without fail, by a method wherein a resin containing elastically deforming conductive particles is provided on electrodes of a semiconductor device and wiring patterns of a substrate, so that the conductive particles may be pressurized to be single layered for connection between the semiconductor device and the substrate. SOLUTION: Wiring patterns 5 are formed in the shape corresponding to the electrodes 2 of a semiconductor device 1 on a glass substrate 6. Next, a resin 4 containing Au plated conductive particles 3 is screen-printed on the positions corresponding to the electrodes 2 on the patterns 5 on the balls. Later, the glass substrate 6 or the semiconductor 1 is coated with an epoxy base adhesive 7 and after making alignment of the electrodes 2 of the semiconductor device 1 with the wiring patterns 5, and adhesive 7 is cured while pressurizing the semiconductor device 1 to be fixed. At this point, the conductive particles 3 are left as one layer only between the semiconductor device 1 and the substrate 6. Furthermore, the squeeze of the conductive particles 3 is specified to be within the range of 10-50% of the particle diameter thereof for lowering the connecting resistance.</p> |
