发明名称 Electrical device with heat sink mat for electronic component board
摘要 <p>The electrical device has a housing (11) receiving an electronic component board (14) carrying a number of power electronic components (13), attached to the inside of the housing cover (12). An elastic heat sink mat (17) is fitted in the housing for providing a heat conductive contact between the inserted electronic component board and the housing wall (18), for dissipation of the waste heat generated by the electronic components, which are partially embedded in the heat sink mat.</p>
申请公布号 DE19734110(C1) 申请公布日期 1998.11.19
申请号 DE1997134110 申请日期 1997.08.07
申请人 ROBERT BOSCH GMBH, 70469 STUTTGART, DE 发明人 FASSEL, REINHARD, 90522 OBERASBACH, DE;ZOEBL, HARTMUT, 90762 FUERTH, DE
分类号 H05K3/28;H05K5/00;H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K3/28
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