Electric heating element with thermally conductive layer

摘要

The thermally conductive semiconductor layer (51) is connectable to at least two electric contacts (52,53) and is preferably formed by a thin film deposition process, typically by chemical vapour deposition (CVD). The thermally conductive layer is deposited on an insulating substrate, preferably of ceramic material. The thermally conductive layer may be bent, at least partly and/or contain steps, may be enclosed in at least one dimension, and may be laterally extended in at least one direction of more than 1 mm, preferably 10 to 300 mm. The lay thickness is 0.1 to 5 microns, typically 2 microns.