| 发明名称 |
Plastic ball grid array module |
| 摘要 |
A Plastic Ball Grid Array electronic package having the conductive metal pads of variable area. The central pads are wider than those closer to the border for compensating the warpage effect on the final package. <IMAGE> |
| 申请公布号 |
EP0814511(A3) |
申请公布日期 |
1998.11.18 |
| 申请号 |
EP19970304020 |
申请日期 |
1997.06.10 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GARBELLI, FRANCESCO;OGGIONI, STEFANO |
| 分类号 |
H01L23/12;H01L21/60;H01L23/31;H01L23/498;H05K1/11;H05K3/34 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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