A footprint for adaptable MMIC arrays is disclosed in which the size, number and location of the array components is optimized for the fabrication by depositing a personalizing metal interconnecting layer on the array, of essentially any MMIC circuit from a single footprint layout.
申请公布号
EP0878024(A1)
申请公布日期
1998.11.18
申请号
EP19970940628
申请日期
1997.08.25
申请人
NORTHROP GRUMMAN CORPORATION
发明人
MOGHE, SANJAY;DIETZ, GREGORY, R.;FUDEM, HOWARD, N.
