| 摘要 |
According to a method of manufacturing a semiconductor device of this invention, a first lead frame portion (4) has a bed portion (8) for mounting a semiconductor element (9) and a plurality of inner (2) and outer leads (3). A second lead frame portion (4) has a bed portion (8) for mounting a semiconductor element (9) and a plurality of inner and outer leads (2, 3) as in the first lead frame portion (4) coupled to the second lead frame portion (4) through a coupling portion. The first and second lead frame portions (4, 4) are folded at the coupling portion and superposed each other such that the two semiconductor elements (9, 9) oppose each other. At this time, the plurality of inner and outer leads (2, 3) of the first and second lead frames (4, 4) are alternately and adjacently arranged. Each electrode of the semiconductor elements (9, 9) is connected to a corresponding inner lead (2). The superposed first and second lead frames (4, 4) are sealed with a mold resin (10) while leaving end portions of the plurality of outer leads (3) of the first and second lead frames (4, 4). <IMAGE> <IMAGE> |
