发明名称 Method for fabricating a semiconductor device including a semi-insulating semiconductor layer
摘要 <p>A method for fabricating a compound semiconductor device having a semi-insulating layer (22) of a group III-V compound semiconductor material that contains arsenic as a group V element. The method includes a step of growing the semi-insulating layer on a substrate (21) from a source gas of the group V element that contains both arsine and an organic compound of arsenic, wherein arsine and the organic compound of arsenic are used simultaneously with a mixing ratio to achieve a desired high resistivity in the semi-insulating layer. <IMAGE></p>
申请公布号 EP0439195(B1) 申请公布日期 1998.11.18
申请号 EP19910100991 申请日期 1991.01.25
申请人 FUJITSU LIMITED 发明人 TAKIKAWA, MASAHIKO;OKABE, TADAO;KIKKAWA, TOSHIHIDE
分类号 H01L21/20;H01L21/205;H01L21/338;H01L21/76;H01L29/778;H01L29/812;H01S5/00;(IPC1-7):H01L21/76;H01L29/10;H01L29/205 主分类号 H01L21/20
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