发明名称 |
Method for fabricating a semiconductor device including a semi-insulating semiconductor layer |
摘要 |
<p>A method for fabricating a compound semiconductor device having a semi-insulating layer (22) of a group III-V compound semiconductor material that contains arsenic as a group V element. The method includes a step of growing the semi-insulating layer on a substrate (21) from a source gas of the group V element that contains both arsine and an organic compound of arsenic, wherein arsine and the organic compound of arsenic are used simultaneously with a mixing ratio to achieve a desired high resistivity in the semi-insulating layer. <IMAGE></p> |
申请公布号 |
EP0439195(B1) |
申请公布日期 |
1998.11.18 |
申请号 |
EP19910100991 |
申请日期 |
1991.01.25 |
申请人 |
FUJITSU LIMITED |
发明人 |
TAKIKAWA, MASAHIKO;OKABE, TADAO;KIKKAWA, TOSHIHIDE |
分类号 |
H01L21/20;H01L21/205;H01L21/338;H01L21/76;H01L29/778;H01L29/812;H01S5/00;(IPC1-7):H01L21/76;H01L29/10;H01L29/205 |
主分类号 |
H01L21/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|