| 摘要 |
PROBLEM TO BE SOLVED: To enable a terminal fixing operation to be carried out in the same process as mounting of a standard part so as to lessen a hybrid integrated circuit device in assembly man-hours and jig cost without using a special jig, by a method wherein a chip part is mounted so as to serve also as a terminal used for electrically connecting the hybrid integrated circuit device to the outside and fixing it to a board. SOLUTION: A surface-mounting hybrid integrated circuit device is equipped with a chip 1 which is used for electrically connecting the hybrid integrated circuit device to the outside and fixing it to a board, where the chip 1 is fixed to the underside of a film circuit board 2 with solder 3. The chip 1 is fixed through such a manner that it is mounted at a standard pitch so as not to protrude from the film circuit board 2 taking workability and reliability into consideration, and it is connected in series with the film circuit board 2 and board 5 so as not to lose its function such as a resistor or a capacitor. Therefore, a chip can be mounted through the same process with a standard part without using a special jig and a terminal forming operation, whereby a hybrid integrated circuit device lessened in size can be realized. |
