发明名称 ELECTRONIC COMPONENT AND ITS MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To stably stand an electronic component by itself, at a free height on a circuit board by using simple structure. SOLUTION: A flat part 4b is formed on a part of a lead wire 4a of an LED 4. The flat part 4b is bent at a right angle twice, and a holding part 4d and an insertion part 4e are formed. The lead wire 4a is inserted in a fixing hole 3b of a circuit board 3, the holding part 4d is made to abut against the upper surface of the circuit board 3, and the insertion part 4e is forcibly inserted in the fixing hole 3b. Since the holding part 4d is in surface-contact with the circuit board 3, generation of lateral falling-down can be prevented, and the height of the LED 4 can be easily adjusted by adjusting the bending position.
申请公布号 JPH10308571(A) 申请公布日期 1998.11.17
申请号 JP19970116706 申请日期 1997.05.07
申请人 TOSHIBA CORP 发明人 OKU HIDENORI
分类号 H05K1/18;H01L23/48;H05K3/30;(IPC1-7):H05K1/18 主分类号 H05K1/18
代理机构 代理人
主权项
地址