| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processor in which it is possible to easily facilitate a countermeasure to chemicals, and to process a substrate with high quality. SOLUTION: Wafers are successively processed by a chemicals processing part MTC and a washing and drying processing part DTC, and a clean wafer can be obtained. The carriage of the wafer from an indexer part IND to each processing part MTC and DTC is operated by first and second carrying robots MTR1 and MTR2 constituted of articulated robots. The first and second carrying robots MTR1 and MTR2 can perform access to each processing part MTC and DTC and wafer placing plates P1 and P2 by the bending of the articulates, and seal for a countermeasure to chemicals can be easily attained. Also, the first and second carrying robots MTR1 and MTR2 are provided with two arms each, that is, wafer carrying-in arms B1 and C1 and wafer carrying-out arms B2 and C2. Therefore, the wafers can be held by the different arms at the time of pre-processing and post-processing at each processing part MTC and DTC. |
