发明名称 Acoustic wave devices on diamond with an interlayer
摘要 Embedded IDT electrodes are provided in a multilayer structure consisting of a diamond layer on a substrate with IDT electrodes formed on the diamond and a very thin interlayer covering the interdigitated transducer structure and the diamond, thus embedding the IDT electrodes between the diamond layer and the interlayer, with a piezoelectric layer on the interlayer so that an acoustic surface wave propagates in the diamond layer. The very thin interlayer between the diamond and the piezoelectric layer greatly increases the uniformity of the piezoelectric layer but does not interfere with the acoustic properties of a SAW device.
申请公布号 US5838089(A) 申请公布日期 1998.11.17
申请号 US19970802272 申请日期 1997.02.18
申请人 KOBE STEEL USA INC. 发明人 DREIFUS, DAVID L.;HOLMES, JOSEPH S.
分类号 H03H3/08;H03H9/02;H03H9/25;(IPC1-7):H03H9/25;H01L41/18 主分类号 H03H3/08
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