发明名称 |
Fully additive method of applying a circuit pattern to a three-dimensional, nonconductive part |
摘要 |
A fully additive method of applying a circuit pattern to a three-dimensional, nonconductive part comprises: pretreating the surface of the part; pad-printing a surface catalyst in a solvent carrier onto the surface in the shape of a desired circuit pattern; and applying an electroless copper deposit onto the surface catalyst, thereby providing a copper layer on the surface in the desired circuit pattern shape.
|
申请公布号 |
US5837609(A) |
申请公布日期 |
1998.11.17 |
申请号 |
US19970784886 |
申请日期 |
1997.01.16 |
申请人 |
FORD MOTOR COMPANY |
发明人 |
TODD, MICHAEL GEORGE;BELKE, JR., ROBERT EDWARD;GLOVATSKY, ANDREW ZACHARY |
分类号 |
H05K1/00;H05K3/18;(IPC1-7):H01L21/44 |
主分类号 |
H05K1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|