发明名称 POLISHING LIQUID COMPOSITION FOR SLICING
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition capable of readily, smoothly, safely and inexpensively slicing the objective material such as a magnetic material in a short time by mixing.dispersing a dispersion medium containing a mineral oil and/or vegetable oil with polishing fine powder. SOLUTION: This composition is obtained by mixing.dispersing (A) 100 pts.wt. of a dispersion medium obtained by emulsifying 20-60 pts.wt. of a mineral oil and/or vegetable oil, preferably a mineral oil having a boiling point within the range of 150-400 deg.C and/or a vegetable oil of a liquid at a normal temperature in 40-80 pts.wt. of water, in the presence of a surfactant with (B) 30-150 pts.wt. of polishing fine powder having 1.2-60μm average particle diameter. Preferably, the component B is selected from silicon carbide, alumina and boron carbide, and viscosity of the objective composition measured by a B-type viscometer at 25 deg.C is within the range of 50-1,000 cp.
申请公布号 JPH10306275(A) 申请公布日期 1998.11.17
申请号 JP19970131717 申请日期 1997.05.06
申请人 SHINANO DENKI SEIREN KK 发明人 KOIKE KEIJI;AOYAMA SHINICHIRO;KAZAMA KESAO
分类号 C09K3/14;H01L21/304;(IPC1-7):C09K3/14 主分类号 C09K3/14
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