发明名称 Apparatus having a substrate and electronic circuit solder-connected with the substrate
摘要 An electronic circuit apparatus has first and second pad electrodes arranged on a substrate to be separated by a first interval, first and second chip electrodes to be separated by a second interval smaller than the first interval, a first solder for fixedly attaching the first chip electrode to the first pad electrode and a second solder for fixedly attaching the second chip electrode to the second pad electrode. Because the first interval is longer than the second interval, any constricted portion does not exist in each of the first and second solders. Therefore, because any stress is not concentrated on any portion of each of the first and second solders, the occurrence of a crack in each of the first and second solders can be prevented.
申请公布号 US5838070(A) 申请公布日期 1998.11.17
申请号 US19960770406 申请日期 1996.12.20
申请人 SANYO ELECTRIC CO., LTD. 发明人 NARUSE, TOSHIMICHI;SAKAMOTO, NORIAKI
分类号 H05K1/11;H05K3/34;(IPC1-7):H01L23/48;H01L23/52 主分类号 H05K1/11
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