发明名称 |
High performance, low cost multi-chip modle package |
摘要 |
A high performance, low cost multi-chip module package using a heatsink as a substrate with thin film wiring techniques or multilayered wiring techniques for interconnection of the chips on the surface of the module and a solder column grid array or solder ball grid array for interconnection to the next level of packaging (printed circuit board). The columns or balls create a space between the board and module with the chips being in the space and provide the required interconnect density. |
申请公布号 |
US5838545(A) |
申请公布日期 |
1998.11.17 |
申请号 |
US19960733154 |
申请日期 |
1996.10.17 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CLOCHER, DENNIS F.;DAVES, GLENN G.;ELENIUS, PETER M.;LISOWSKI, JOSEPH J.;SULLIVAN, JOSEPH M. |
分类号 |
H01L23/367;H01L25/065;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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