摘要 |
PROBLEM TO BE SOLVED: To reduce the installation space of an overall chemical processing system used for wafer processing by reducing the size a wafer chuck cleaning bath. SOLUTION: The wafer processing system comprises a pair of opposed wafer holder 5 and 6, a wafer chuck 4 consisting of a driving means 7 for moving the wafer holder 5 and 6 away from and toward each other, a wafer processing bath 2, and a wafer chuck cleaning bath 3. When cleaning the wafer chuck 4, the driving means 7 moves pair of wafer holder 5 and 6 toward each other shorter than the distance between 5 and 6 when holding the wafer 1 so that a pair of wafer holder 5 and 6 can enter the wafer chuck cleaner bath 3. The width of the wafer chuck cleaning bath 3 is narrower than that of the wafer processing bath 2. |