POSITIVE PHOTOSENSITIVE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a positive photosensitive composition capable of providing a resist pattern good in sensitivity and resolution and capable of showing sufficiently resistance to dry etching at the time of using an exposure light source of <=250 nm especially, <=220 nm. SOLUTION: This photosensitive composition contains (A) a compound producing acid by irradiating with activated light rays or radiation and (B) a resin having respectively at least one of polycyclic aliphatic groups and at least each one of ester groups and acetal groups to be decomposed by the action of the acid to increase the solubility in an alkaline developing solution.