| 摘要 |
A wafer map conversion method capable of converting a format file, which includes data about a wafer obtained by category grades through a wafer testing device and all information associated with the wafer in accordance with a certain format, into a configuration file or standard file which can be practically applied to a die bonding device, thereby easily checking the content of the process through a processing mode translated from the configuration file or standard file. Practically, the die bonding process for good-grade dies by grade levels can be achieved based on BCE data. It is also possible to perform the die bonding process in accordance with a certain map format without requiring any test for the wafer memory and dies. Only selected dies can be processed without requiring an alignment and test for every die. Accordingly, a great improvement in the process quality is obtained. An improvement in yield in processing rate (UPH) is also achieved. The efficiency of the equipment used for the die bonding process is also enhanced. In addition, it is unnecessary to perform the ink dotting process after the probe test. As a result, the manufacturing cost is greatly reduced.
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