SUBSTRATE MOUNTED WITH ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To provide an insulating substrate which is prevented from warping when a part mounted with an electronic part is sealed with resin. SOLUTION: A heat slug 1 is bonded to an insulating substrate 5 having a part 51 mounted with an electronic part. The heat slug 1 comprises a flat main body 15 arranged opposite to the insulating substrate 5 and projections 13 extending from the sides thereof. The main body 15 is bonded to the insulating substrate 5 via a resin-bonded layer 2. The projections 13 are inserted into positioning holes 6 and fixed thereto with solder 4. The heat slug 1 has a deforming part which absorbs the deformation of the insulating substrate 5 between the resin-bonded part 12 of the main body 15 and the solder-bonded part 14 of the projection 13. The deforming part is a slit 11 or a thin-walled part and is made at the peripheral part of the main body 15 where the projection 13 extends or at the part where the projection 13 abuts on the main body 15.