发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a polyamide resin composition, having excellent rigidity and toughness together and especially excellent in high-speed planar impact fracture characteristics and having balanced and excellent characteristics of molded product surface appearance and dimensional stability. SOLUTION: This polyamide resin composition is obtained by melt kneading 100 pts.wt. of a polyamide resin with 5-150 pts.wt. of a nonfibrous inorganic filler having 0.05-10μm average particle diameter and/or a fibrous inorganic filler having 0.05-10μm average fiber diameter except glass fibers. The resultant composition has >=4 g/m<2> of the polyamide component sticking to the inorganic filler based on a unit surface area measured by a BET method when dissolving the composition in hexafluoroisopropanol and recovering the inorganic filler.
申请公布号 JPH10306212(A) 申请公布日期 1998.11.17
申请号 JP19980054637 申请日期 1998.03.06
申请人 TORAY IND INC 发明人 KUMAKI JIRO;TOGAWA MITSUNARI;KATO KIMIYA
分类号 C08K3/00;C08K7/02;C08L77/00;(IPC1-7):C08L77/00 主分类号 C08K3/00
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