| 摘要 |
PROBLEM TO BE SOLVED: To provide an additive method laminated board for a printed wiring board wherein copper precipitation is little, by improving plating stickiness of nonelectrolytic copper of a laminated board, and performing nonelectrolytic copper plating in the state that activity of nonelectrolytic copper plating solution is decreased. SOLUTION: A prepreg is obtained by impregnating a reinforcing substrate with epoxy resin varnish containing at least epoxy resin, epoxy resin curing agent, nonelectrolytic plating catalyst and organic solvent. A laminated board is obtained by laminating a specified number of the prepregs and heating, pressing and molding the laminated prepregs. The epoxy resin curing agent is parasubstituted alkyl phenolic novolak resin of phenolic hydroxyl group equivalent from 1.0 to 1.6 to epoxy resin of 1 epoxy equivalent. |
