| 摘要 |
<p>PROBLEM TO BE SOLVED: To evade a defect in mounting a device chip, and to improve the measurement precision of electric inspection and to shorten a maintenance time. SOLUTION: After a solder film pattern 7a which is connected to an Al-based electrode pad 2 through a ball limiting metal(BLM) film 5 is formed and a low-temperature short-time heat treatment for ohmic connection between those BLM film 5 and solder film pattern 7a is performed, electric inspection is performed by bringing a measuring probe P1 into contact with the solder film pattern 7a under conditions of a diameter of 10μmϕand stylus pressure (overdrive quantity) of 20μm at the tip part. A wet back process for solder ball formation is performed after the electric inspection, so no influence of a probe trace 8a on the finish shape of a final solder ball is recognized and its height uniformity becomes excellent. Therefore, a defect in mounting at the time of the mounting of a flip chip on a printed wiring board is evaded.</p> |
