发明名称 |
Insulating resin composition for build-up by copper foil lamination and method for production of multilayer printed circuit board using the composition |
摘要 |
An insulating resin composition for the build-up of multilayer circuits by the procedure of copper foil lamination and a method for the production of a multilayer printed circuit board by the use of the insulating resin composition are disclosed. The insulating resin composition comprises at least one species of epoxy resin having a softening point of not more than 110 DEG C., a monomer or an oligomer possessing an unsaturated double bond, an epoxy resin curing agent, and a photopolymerization initiator. The insulating resin composition is applied to a printed circuit board throughout the entire area thereof so as to cover conductor patterns formed thereon and then irradiated with UV light. Subsequently a copper foil is superposed on the applied layer of the insulating resin composition on the printed circuit board by means of a heated pressure roller to effect lamination thereof. The insulating resin composition is thermally cured to give a multilayer laminate and then the outer layer copper foil of the produced multilayer laminate is selectively etched to form a prescribed conductor pattern.
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申请公布号 |
US5837155(A) |
申请公布日期 |
1998.11.17 |
申请号 |
US19960696661 |
申请日期 |
1996.08.14 |
申请人 |
TAIYO INK MANUFACTURING CO., LTD. |
发明人 |
INAGAKI, SHOJI;TAKEHARA, EIJI |
分类号 |
B32B15/08;B32B15/20;C08F283/10;C08G59/40;H05K1/03;H05K3/46;(IPC1-7):B44C1/22 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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