| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide the connection structure of a semiconductor element which can make a stable electric connection with a high fixing force. SOLUTION: To connect a semiconductor element 10 having a bump 16 formed on an electrode 14 and a component having a connection electrode 20 formed opposite the bump position to each other, a synthetic resin material having conductive powder 24 dispersed is arranged between the semiconductor element 9 and component. Then gold is used as the bump material and a metal material which form an eutectic junction or alloy junction with gold is used as a connection electrode material; and the bump 16 and connection electrode 20 are brought into contact with each other and the eutectic junction or alloy junction is formed on the contact boundary surface. Consequently, not only a resin fixing force, but also a fixing force by the eutectic junction or alloy junction is applied, so a stronger secure electric connection can be obtained.</p> |
