| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for enhancing a mechanical strength of an IC card by sufficiently ensuring a thickness of the card even when the thickness of the card is thin in a thin type IC card. SOLUTION: In the thin type IC card having a card thickness of about 0.8 mm, an IC chip 7 and a substrate 2 are face down disposed, and a pad 12 of the chip 7 is electrically connected to a wiring land 10 of the substrate 2 via a bump 9. Thus, the chip 7 is connected to the substrate 2 without using a wire or sealing resin, and a thickness of the chip 7 is increased that much of eliminated disposing space of the wire or resin. For example, the thickness is set to 0.3 to 0.4 mm to enhance a mechanical strength of the card. |
