发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING PATTERN BY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a photoresist composition high in transparency to far ultraviolet rays of <=248 nm a wavelength, especially, an ArF eximer laser, superior in resistance to dry etching, good in adhesion to a substrate and showing good solubility in an alkaline developing solution and having high sensitivity and resolution. SOLUTION: This photoresist composition contains a polymer obtained by polymerizing a polymer precursor including a vinyl monomer represented by the formula and a light exposure acid generating agent generating an acid by exposure to light. In the formula, R<1> is an H atom or a methyl group, R<2> is a 7-22C cross-linked cyclic hydrocarbon group, each of (m) and (n) is 0 or 1 and R<3> is an H atom, a methyl or acetyl group.
申请公布号 JPH10307400(A) 申请公布日期 1998.11.17
申请号 JP19980038207 申请日期 1998.02.20
申请人 NEC CORP 发明人 NAKANO KAICHIRO;MAEDA KATSUMI;IWASA SHIGEYUKI;HASEGAWA ETSUO
分类号 G03F7/039;C08F220/18;C08F220/28;C08K5/00;C08L33/06;C08L33/14;G03F7/004;G03F7/038;H01L21/027;(IPC1-7):G03F7/039 主分类号 G03F7/039
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