发明名称 |
Semiconductor device having a ridge or groove |
摘要 |
The invention provides a semiconductor device having a structure wherein a layer comprising at least AlWGa1-WAs is formed on a substrate and a second etching stop layer, a first etching stop layer and a layer comprising AlYGa1-YAs are deposited on the layer comprising AlWGa1-WAs in the described order, with a portion of the layer comprising AlYG1-YAs and a portion of the first etching stop layer being removed. This structure enables a desired ridge shape to be fabricated with good quality and allows for free selection of the Al mixed crystal ratio of the layer to be etched, and makes it possible to form the re-growth interface of GaAs. Thus, the qualty of crystal of the re-grown portion can be improved.
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申请公布号 |
US5838028(A) |
申请公布日期 |
1998.11.17 |
申请号 |
US19970861640 |
申请日期 |
1997.05.22 |
申请人 |
MITSUBISHI CHEMICAL CORPORATION |
发明人 |
HORIE, HIDEYOSHI;FUJIMORI, TOSHINARI;NAGAO, SATORU;GOTOH, HIDEKI |
分类号 |
H01L21/306;H01L33/02;H01L33/14;H01L33/30;H01S5/20;H01S5/22;H01S5/223;H01S5/227;H01S5/32;H01S5/323;(IPC1-7):H01S3/19;H01L31/038;H01L31/033;H01L31/072 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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