发明名称 LASER CUTTING METHOD ELIMINATING DEFECTS IN REGIONS WHERE CUTTING CONDITIONS ARE CHANGED
摘要 <p>A laser cutting method with which cutting faults at the time of cutting condition changing are substantially eliminated. Impingement of the laser beam on the workpiece is stopped when the laser beam reaches a position along the path where the first cutting conditions are to be changed to second cutting conditions. The laser beam is then retracted along the path a predetermined distance from the position where the first cutting conditions are to be switched to the second cutting conditions. After a delay time, the laser beam is again moved along the predetermined path to cut the workpiece under the second cutting conditions. The retraction distance is set in accordance with the thickness of the workpiece. Also, an assist gas may be sprayed on the workpiece in the vicinity of the cutting path while impingement of the beam is stopped.</p>
申请公布号 KR0153084(B1) 申请公布日期 1998.11.16
申请号 KR19950003693 申请日期 1995.02.24
申请人 MITSUBISHI DENKI KK. 发明人 KANAOKA, MASARU;MORI, HOMARE;YUYAMA, TAKAYUKI;TAKENO, SHOZUI
分类号 B23K26/00;B23K26/08;B23K26/14;B23K26/36;B23K26/38;(IPC1-7):B23K26/00 主分类号 B23K26/00
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