| 摘要 |
PROBLEM TO BE SOLVED: To maintain an electrical insulation between electrodes easily and securely by a method wherein a side groove for blocking the flow of conductive adhesive is provided between electrode terminals on a board and the width, length and depth of the side groove are specified. SOLUTION: A side groove for blocking the flow of conductive adhesive is provided on electrode terminals on a mounting board and the width of the side groove is 0.1-1.0 times of a distance between the electrode terminals and the length of the side groove is 1.0-3.0 times of the length of the electrode terminal and the depth of the groove is 20-500μm. One of methods by which the side groove is formed in the board is such that a sheet in which holes are formed beforehand is applied when the uppermost layer of a non-conductor part is formed and a metal layer is provided on the sheet and patterned to form a wiring. Or, the side groove can be formed by etching, etc., after the wiring is formed. It is to be noted that the capacity of the side groove may be large enough to accommodate conductive adhesive overflowing the electrode of the wiring board when an electronic component is mounted on the wiring board. |
