| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method which can prevent or restrain prepreg resin from being melted and blown out from holes of a substrate for an outer layer and from sticking on the surface of a conducting layer for an outer layer circuit, and from excluding contamination of a metal mold plate when a film for release is interposed. SOLUTION: This manufacturing method sandwiches a laminate 11 between metal mold plates 9, 9 and heats and press-molds it. The laminate 11 is formed by stacking a board 6 for an outer layer on another board interposing prepreg 7, in such a manner that the surface having a conductive layer 4 is set outside. The board 6 has penetrating holes 2, and is provided with the conductive layer 4 for an outer layer circuit on one surface. On the surface of the conductive layer 4 for the outerlayer circuit of the board 6 constituting the laminate 11, a metal foil 12 is arranged by interposing a thermoplastic resin layer 13 which is softened at a temperature lower than the melting temperature of resin constituting the prepreg 9 and has a melting point higher than the heating temperature at the time of molding. After heating and press-molding, the thermoplastic resin layer 13 and the metal foil 12 are peeled and eliminated. |
