发明名称 |
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE |
摘要 |
PROBLEM TO BE SOLVED: To control the sneaking of resin to the backside of a tape carrier sealing resin and to realize slim TCP(tape carrier package). SOLUTION: A device is constituted of a tape carrier 2 which is provided with backside 2c that are overlapped and arranged with the outer peripheral part of a main face 1b of a semiconductor chip 1 and is provided with auxiliary opening parts 2e promoting the infiltrating of sealing resin at the time of sealing resin and of a resin sealing part 6 which resin-seals a joint part 4 of the electrode of the semiconductor chip 1 and the lead 2a of the tape carrier 2 and the peripheral part 5. Each auxiliary opening part 2e is provided for both end parts of a long device hole 2d where the leads 2a of the tape carrier 2 are arranged. Thus, the sneaking of resin from the main face 2b of the tape carrier 2 to a backside 2c in sealing resin is promoted.
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申请公布号 |
JPH10303255(A) |
申请公布日期 |
1998.11.13 |
申请号 |
JP19970109982 |
申请日期 |
1997.04.28 |
申请人 |
HITACHI LTD;HITACHI CHIYOU LSI SYST:KK;HITACHI DEVICE ENG CO LTD |
发明人 |
OKAMURA KAZUHIRO;ICHIHARA SEIICHI;MORI HIROYUKI;AKIMOTO KOJI;KIMURA MAKOTO |
分类号 |
H01L21/60;H01L21/56;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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