| 摘要 |
<p>PROBLEM TO BE SOLVED: To measure an assembly organization in the direction of a plate thickness accurately and quickly by scanning a plurality of layers that are in parallel with the surface of a metal material with electron beams and calculating the crystal orientation distribution (ODF) strength in a specific orientation from crystal orientation data for each layer being obtained from the diffraction pattern of reflection electron beams. SOLUTION: A sample 1 is cut from a metal material S and is divided into a plurality of layers 21-2N that are in parallel with a rolled surface over the measurement depth of the assembly organization of the metal material S. Then, while the sample 1 is moved automatically at a constant interval, electron beams are applied to an electron beam irradiation point 4 within a specific range for each of the layers 21-2N, an electron beam rear scattering pattern(EBSP) is detected by a two-dimensional screen detector that is installed in a reflection electronic diffraction cone being generated at each irradiation point 4. Then, the EBSP is analyzed for obtaining the crystal orientation of each crystal particle and the crystal orientation file for each layer is created, thus specifying an ODF function at an arbitrary position from the surface of the metal material S. Then, ODF strength at a specific orientation is calculated by the ODF function.</p> |
