| 摘要 |
<p>PROBLEM TO BE SOLVED: To hardly move moisture in a plastic wiring board between a semiconductor element and an adhesive material layer even in the case that the plastic wiring board is heated, and to prevent the generation of a so-called popcorn phenomenon that the moisture present between the semiconductor element and the adhesive material layer is suddenly expanded to turn inner moisture to steam and pushes up the semiconductor element by using the plastic wiring board. SOLUTION: A wiring board 10 is provided with a chip loading conductor layer or the like formed by executing an etching processing to metal foil adhered to both surfaces of a plastic substrate 11. In this case, a solid pattern conductor layer 17 is formed by providing the formation area of plural pads 15b for a solder ball on a mother board connection surface 22, and an opening part 17a for discharging the moisture is formed at the peripheral part of the solid pattern conductor layer 17.</p> |
