DEVICE FOR FABRICATING BONDING LAYER, DEVICE FOR FABRICATING BOTH-SURFACE BOARD, AND DEVICE FOR FABRICATING MULTI-LAYER BOARD

摘要

PROBLEM TO BE SOLVED: To eliminate a plating process by forming holes at the predetermined positions of a laminated body comprising a prepreg and a film material and by providing a separating part where the film material is separated from the laminated body filled with conductive paste. SOLUTION: In a sticking part 1, a film material 18 of polyethylene telephthalate and the like is heated and pressed to a prepreg 17 made of glass epoxy to form a laminated body 19 and a predetermined number of holes 20 are made in the predetermined positions. The holes 20 are filled with conductive paste 21 at a filling part 3 with a squeegee and the film material 18 is separated from the laminated body 19 at a separating part 4 to form a bonding layer 22. This is a fine device for eliminating a plating process by fabricating the bonding layer 22 comprising a separating part 4 for separating the film material from the laminated body 19 having holes 20 filled with conductive paste 21.